MicroSanj: High resolution and high speed thermal imaging based on the thermoreflectance principle

Microsanj has developed a solution for high resolution and high speed thermal imaging based on the thermoreflectance principle. Their solutions are used for microelectronic and optoelectronic device and circuit thermal design and characterization with a focus on spatial, temporal, and temperature resolution. 

Their solution could be interesting if you are struggling with:

• Decreasing feature sizes
• Increasing circuit densities
• Importance of Reliability & MTTF
• Electrical performance is affected by thermal events
• Electro-thermal optimization is necessary for best performance (i.e. for GaN HEMT’s)

Their solutions are unique for its resolution and measurement speed which is far better then anything IR can offer. It enables engineers to do thermal failure analysis in a way that was not possible before. This gives insight that greatly optimizes the design and reliability of power amplifier IC’s. Their solution can be integrated on almost any microscope. 

We have their demo system in our office and are happy to provide a demonstration. See attached presentation for more information.

Above you find a screenshot I made from a 4micron wire in a square shape. The size of this wire is 0.95×0.95mm which gives you an idea what details you can get with a 20x microscope. With a better microscope and vibration free table, you can achieve even better results.